Please use this identifier to cite or link to this item: https://hdl.handle.net/10316/109751
Title: Candida albicans CUG mistranslation is a mechanism to create cell surface variation
Authors: Miranda, Isabel
Silva-Dias, Ana
Rocha, Rita 
Teixeira-Santos, Rita
Coelho, Carolina 
Gonçalves, Teresa M. 
Santos, Manuel A. S. 
Pina-Vaz, Cidália 
Solis, Norma V
Filler, Scott G
Rodrigues, Acácio G
Issue Date: 30-Aug-2013
Project: POCI/SAU-IMI/61598/2004 
FCT Ciência 2008 and the European Social Fund 
Ph.D. grant (SFRH/BD/44896/2008 
R01AI054928 and R01DE017088 from the National Institutes of Health, United States 
Serial title, monograph or event: mBio
Volume: 4
Issue: 4
Abstract: In the human fungal pathogen Candida albicans, the CUG codon is translated 97% of the time as serine and 3% of the time as leucine, which potentially originates an array of proteins resulting from the translation of a single gene. Genes encoding cell surface proteins are enriched in CUG codons; thus, CUG mistranslation may influence the interactions of the organism with the host. To investigate this, we compared a C. albicans strain that misincorporates 28% of leucine at CUGs with a wild-type parental strain. The first strain displayed increased adherence to inert and host molecules. In addition, it was less susceptible to phagocytosis by murine macrophages, probably due to reduced exposure of cell surface β-glucans. To prove that these phenotypes occurred due to serine/leucine exchange, the C. albicans adhesin and invasin ALS3 was expressed in Saccharomyces cerevisiae in its two natural isoforms (Als3p-Leu and Als3p-Ser). The cells with heterologous expression of Als3p-Leu showed increased adherence to host substrates and flocculation. We propose that CUG mistranslation has been maintained during the evolution of C. albicans due to its potential to generate cell surface variability, which significantly alters fungus-host interactions.
URI: https://hdl.handle.net/10316/109751
ISSN: 2161-2129
2150-7511
DOI: 10.1128/mBio.00285-13
Rights: openAccess
Appears in Collections:I&D CNC - Artigos em Revistas Internacionais

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