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Title: 3R Electronics: Scalable Fabrication of Resilient, Repairable, and Recyclable Soft-Matter Electronics
Authors: Tavakoli, Mahmoud 
Lopes, Pedro Alhais 
Hajalilou, Abdollah
Silva, André F. 
Carneiro, Manuel Reis
Carvalheiro, José
Pereira, João Marques
Almeida, Aníbal T. de 
Keywords: biphasic liquid metal; electronic waste; recyclable electronics; soft-matter electronics; wearable biomonitoring
Issue Date: Aug-2022
Publisher: Wiley
Project: PTDC/EEIROB/31784/2017/Dermotronics 
POCI-01-0247- FEDER-047153/SMART Display 
CMU-Portugal project WoW/Reference 45913 
Serial title, monograph or event: Advanced Materials
Volume: 34
Issue: 31
Abstract: E-waste is rapidly turning into another man-made disaster. It is proposed that a paradigm shift toward a more sustainable future can be made through soft-matter electronics that are resilient, repairable if damaged, and recyclable (3R), provided that they achieve the same level of maturity as industrial electronics. This includes high-resolution patterning, multilayer implementation, microchip integration, and automated fabrication. Herein, a novel architecture of materials and methods for microchip-integrated condensed soft-matter 3R electronics is demonstrated. The 3R function is enabled by a biphasic liquid metal-based composite, a block copolymer with nonpermanent physical crosslinks, and an electrochemical technique for material recycling. In addition, an autonomous laser-patterning method for scalable circuit patterning with an exceptional resolution of <30 µm in seconds is developed. The phase-shifting property of the BCPs is utilized for vapor-assisted "soldering" circuit repairing and recycling. The process is performed entirely at room temperature, thereby opening the door for a wide range of heat-sensitive and biodegradable polymers for the next generation of green electronics. The implementation and recycling of sophisticated skin-mounted patches with embedded sensors, electrodes, antennas, and microchips that build a digital fingerprint of the human electrophysiological signals is demonstrated by collecting mechanical, electrical, optical, and thermal data from the epidermis.
ISSN: 0935-9648
DOI: 10.1002/adma.202203266
Rights: openAccess
Appears in Collections:I&D ISR - Artigos em Revistas Internacionais

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